<Year of 2014>

1. Microstructure, shear strength, and nanoindentation property of electroplated Sn-Bi micro-bumps, Microelectronics Reliability, Vol 54, Issue 1, p.265-271, January, 2014
2. Analysis of the Electrical Characteristics and Structure of Cu-Filled TSV with Thermal Shack Test, Electronic Materials Letters, Vol 10, Issue 3, p.649-653, May, 2014
3. Effect of Aluminium Additions on Wettability and Intermatallic Compound(IMC) Growth of Lead Free Sn(2wt.%Ag, 5wt.%Bi) Soldered Joints), Electron. Mater. Lett, Vol 10, No. 5, p.997-1004, September, 2014
4. Effect of current density on morphology of electroplated tin, Surface Engineering, 2014
5. Printing Morphology and Rheological Characteristics of Lead-Free Sn-3Ag-0.5Cu (SAC) Solder Pastes, J. Microelectron. Packag. Soc., Vol 24, Issue 4, p.1-7, 2014 (KCI)
6. Plasma Electrolytic Oxidation in Surface Modification, Journal of Welding and Joining, 32권, 3호, p.27-33, June, 2014