Country |
No. |
Title |
|
Germany
|
Nr.4115230
|
Verfahren zur Herstellung einer Flussigphasen Diffusionsbindung unter Verwendung eines Elements mit hohem Diffusionsvermogen als Einsbaumaterial
|
|
Unites States
|
5221039
|
liquid phase diffusion bonding using high diffusivity element as insert material
|
|
South Korea
|
067826
|
liquid phase diffusion bonding using insert with higher melting point than that of base metal
|
|
South Korea
|
0431090
|
Lead(Pb)-free solder with lower melting-point coated layer
|
|
South Korea
|
0400606
|
Fabrication of precoated substrate with lower melting-point lead-free solder
|
|
South Korea
|
0366131
|
Lowe melting-point solder producing less dross
|
|
South Korea
|
0337933
|
Measurement of surface tension using wetting curve
|
|
South Korea
|
0356413
|
Reflow soldering in partial melted state
|
|
South Korea
|
0411144
|
Fluxless reflow solder bumping using Argon-hydrogen plasma
|
|
South Korea
|
1999-0010176
|
VACUUM MELTING DEVICE INCORPORATED IN MOLD
|
|
South Korea
|
10-2000-0002957
|
A Process for Repairing Rolls by Brazing
|
|
South Korea
|
0711585
|
Method for bonding a flexible printed circuit substrateand a rigid printed
circuit substrate to each other atroom temperature using ultrasonic wave
|
|
South Korea
|
0091578
|
SOLDERING METHOD
|
|
South Korea
|
0438354
|
Method to estimate wettability of UBM coated on oneside of sample to molten
solder using Wetting BalanceTest
|
|
South Korea
|
057730
|
METHOD OF MELTING INDUCED DIFFUSION BONDING
|
