<Year of 2001>

1. Study on the Sn-Pb and Sn-Ag Electroplating for Bump Formation in Flip Chip Application. Hyeon Hwang,Soon-Min Hong, Choon-Sik Kang, Jae-Pil Jung. Proceedings of PRICM4. 200
2. Analysis of the reaction between Sn-Ag solder and Ni40Fe/Cu/Ta/Si Under Bump Metallization for Flip Chip Application. Jun Seok Ha, Jae Yong Park, Cheol Woong Yang, Sung Jin Um, Choong Un Kim, Choon Sik Kang, Jae Pil Jung. Proceedings of PRICM4. 2001
3. Fluxless Solder Bumping in Flip Chip Package by Plasma Reflow.Soon-Min Hong, Choon-Sik Kang, and Jae-Pil Jung.2001 International Symposium on Electronic Materials and Packaging(EMAP2001), Hayatt Hotel, Jeju, Korea 2001.11.19-22IEEE-CPMT, Kaist.Advances in Electronic Materials and Packaging ,pp.139-145, 2001
4. A Study on the Solderability of Intermediate Melting Pointed Soler Ball. M.I. Kim, J.K. Moon, J.P. Jung, K. Ikeuchi, S.M. Hong and C.S. Kang. Seventh International Welding Symposium. KOBE, JAPAN. Nov, 20-22, 2001
5. Role of Bi and On on Sn-Ag lead free solder. Moon-il Kim, Joon-Kwon Moon, Kye-Hwan Kwak and Jae-Pil Jung. Proceedings of 2001 international brazing and soldering conference. Yangzhong, China. Oct, 29-31, 2001
6. A study on the Solderability of Sn-Ag-Bi-In Solder Bump to Ni/Cu. joon-kwon Moon, Moon-il Kim, Jae-Pil Jung,  and Kye-Hwan Kwak. Proceedings of the 2001 Annual Autumn Meeting of Korean Welding Society.  KWS. 2001.Oct. 25-26 p156-157
7. Effect of plating layer on the solderability of Sn-3.5Ag-0.7Cu ball. Seok-Won Jung, Kyu-Sik Shin. Jae-Pil Jung. roceedings of the 2001 Annual Autumn Meeting of Korean Welding Society.  KWS. 2001.Oct. 25-26 p159 -164
8. Fluxless Wetting Properties of One-Side-Coated Under Bump Metallurgy and Top Surface Metallurgy. SOON-MIN HONG, JAE-YONG PARK, JAE-PIL JUNG, and CHOON-SIK KANG. Journal of ELECTRONIC MATERIALS, Vol. 30, No.8, 2001
9. Prediction of Thermal Fatigue Life of Lead-Free BGA Solder Joints by Finite Element Analysis. Young-Eui Shin, Kyung-Woo Lee, Kyung-Ho Chang, Seung-Bu Jung and Jae-Pil Jung. Materials Transactions, Vol.42, No.5, May(2001) pp. 809 to 813
10.  Microstructure and Mechanical Properties of Partial Melted Joint Using off Eutetic Lead-Free Solders. Jun-Suk Ha, Choon-Sik Kang, Jae-Yong Park and Jae-Pil Jung. Materials Transactions, Vol.42, No.5, May(2001) pp. 814 to 819
11. A Study on the Fluxless Soldering of Si-wafer/glass Substrate Using Sn-3.5mass%Ag and Sn-37mass%Pb Solder. Soon-Min Hong, Jae-Pil Jung, Choon-Sik Kang and Young-Eui Shin. Materials Transactions, Vol.42, No.5, May(2001) pp. 820 to 824
12. Fluxless Wetting Properties of Top Substrate Metallurgy in Different Pb-Free Solders. Soon-Min Hong, Jae-Yong Park, Jae-Pil Jung and Choon-Sik Kang. Materials Transactions, Vol.42, No.7, July(2001) pp. 1423 to 1427
13. Fluxless flip chip bonding of Si-wafer/bump/glass by plasma treatment. Feb. (2001). New Oleans, USA
14. Computer simulation of time dependent wetting behavior in the wetting balance. Feb. (2001). New Oleans, USA
15. Fluxless Wetting Properties of the UBM-Coated Si-wafer to Pb-free Solders under Differnet Atmosphere. Soon-Min Hong, Jae-Yooung Park, Choon-Sik Kang, and Jae-Pil Jung. Materials Transactions, Vol.42, No.3 (2001) pp. 520 to 527
16. Effect of Plasma Treatment on the fluxless soldering of Si-wafer to glass substrate. Mate 2001. Yokohama (2001)