<Year of 2017>

1. Transient Liquid Phase Bonding of Copper Using Sn Coated Cu MWCNT Composite Powders for Power Electronics, Sri Harini Rajendran, Do Hyun Jung, Wook Sang Jeon, Jae Pil Jung, Applied Science, Vol 9, Issue 3, 2018
2. Liquid Metal Embrittlement of Resistance Spot Welded 1180 TRIP Steel: Effect of Electrode Force on Craking Behavior, Du-Youl Choi, Ashutosh Sharma, Sang-Ho Uhm, Jae Pil Jung, Metals and Materials International, Issue 1, pp 219-228, 2019
3. Effect of ZrO2 Nanomaterials on Wettability and Interfacial Chracteristics of Al-19Cu-11Si-2Sn Filler Metal for Low Temperature Al to Cu Dissimilar Brazing, Do Hyun Jung, Sri Harini Rajendran, Jae Pil Jung, Nanomaterials, Vol 8, Issue 10, pp 784-802, 2018
4. Influence of Nanozied AIN Powders on the Microstructure, Brazeability, and Tensile Properties of Al-based Filler for Low Temperature Al/Cu Dissimilar Brazig, Do Hyun Jung, Jae Pil Jung, Korean Journal of Metals and Materials, Vol 56, Issue 9, pp 664-673, 2018
5. Effect of Sn Content on Filler and Bonding Characteristics of Active Metal Brazed Cu/Al2O3 Joint, Jioh Shin, Ashutosh Sharma, Do Hyun Jung, Jae-Pil Jung, Korean Journal of Metals and Materials, Vol 56, Issue 5, pp 366-374, 2018
6. A Review on Recent Advances in Trasient Liquid Phase (TLP) Bonding for Thermoelectric Power Module, D. H. Jung, A. Sharma, M. Mayer, J. P. Jung, Reviews on Advanced Materials Science, Vol 53, Issue 2, pp 147-169, 2018
7. Influence of dual ceramic nanomaterials on the solderability and interfacial reactions between lead-free Sn-Ag-Cu and a Cu conductor, Do Hyun Jung, Ashutosh Sharma, Jae Pil Jung, Journal of Alloys and Compounds, Vol 743, pp 300-313, 2018
8. Aluminum alloys and their joining methods, Do Hyun Jung, Jae Pil Jung, Journal of the Microelectronics and Packaging Society, Vol 25, Issue 2, pp 9-18, 2018
9. High reliability nano-reinforced solder for electronic packaging, Do Hyun Jung, Bum Gyu Baek, Song Hee Lim, Jae Pil Jung, Journal of the Microelectronics and Packaging Society, Vol 25, Issue 2, pp 1-8, 2018
10. High Technology and Latest Trends of WBG Power Semiconductors, Jung Hyun Lee, Do Hyun Jung, Seung Jin Oh, Jae Pil Jung, Journal of the Microelectronics and Packaging Society, Vol 25, Issue 4, pp 17-23, 2018
11. Transient Liquid Phase Diffusion Bonding Technology for Power Semiconductor Packaging, Jung Hyun Lee, Do Hyun Jung, Jae Pil Jung, Journal of the Microelectronics and Packaging Society, Vol 25, Issue 4, pp 9-15, 2018