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- Ultrasonic Bonding of Si/SnAg/FR4 at Ambient Temperature, Jung-Mo Kim, Kyoo-Seok Kim, and Jae-pil Jung, 2006 Korea-Japan Joint Symposium on Microjoining Technology, August 29, 2006
- Environment-Friendly fluxless Soldering with lead-free solder, Jae Pil Jung, Smart Processing Technology Vol 1(2006),pp147-153, High Temperature Society of Japan
- Characteristics of Sn-Cu Solder Bump Formed by Electroplating for Flip Chip ; Seok Won Jung, Jae Pil Jung, and Y(Norman) Zhou; IEEE Transactions on Electronics Packaging Manufacturing, Vol. 29, No. 1,p.10-16, January 2006,
- Ultrasonic bonding properties of FPCB / Rigid PCB, Kyoo-Seok Kim, Young-Woo Lee, Sung-Jung Hong, Ki-Ju Lee, Jae Pil Jung, The Korean Microelectronics and Packaging Society
- Ultrasonic bonding of FPCB and PCB at room temperature , Kyoo-Seok Kim, Young-Woo Lee, Sung-Jung Hong, Ki-Ju Lee, Jae Pil Jung, The Korean Welding and Joining Society, 2006
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