<Year of 2008>

1. Effect of Laser Parameter on the Caracteristics of a Sn-3.5%Ag Solder Joint, Jeng-O Kim, Jae Pil Jung, Jae Hoon Lee, Jeong-Suh, Hee-Shin Kang, Metals And Materials International, Vol. 15, No. 1, pp. 119-123, 2008
2. Effect of Laser Parameter on the Bond Characteristics of Sn-3.5%Ag Solder Ball, Jeng O Kim, Jae Pil Jung, Jae Hoon Lee, Jeong Suh, Hee Shin Kang, Materials Science Forum, Vols. 580-582, pp.191-196, 2008
3. Bending Fatigue Characteristic of Sn-3.5Ag Solder bump on Ni-UBM, K.I. Kang, J.P. Jung, W.H. Bang, J.H. Park, K.H. Oh, Materials Science Forum, Vols. 580-582, pp.177-182, 2008
4. Characteristics of Sn8Zn3Bi solder joints and crack resistance with various PCB and lead coatings, Young Woo Lee, Ki ju Lee, Y. Norman Zhou, Jae-Pil Jung, Microelectronics Reliability 48, pp.631-637, 2008
5. Ambient Temperature Ultrasonic Bonding of Si-Dice Using Sn-3.5%wt.%Ag, Jung-Mo Kim, Jae-Pil Jung, Y.Norman Zhou, Joung-Young Kim, Jounal of ELECTRONIC MATERIALS, Vol. 37, No. 3, pp.324-330, 2008
6. Longitudinal Ultrasonic Bonding og Electrodes between Rigid and Flexible Printed Circuit Boards, Jong-Bum LEE, Ja-Myeong KOO, Soon-Min HONG, Hyoyoung SHIN, Young-jun MOON, Jae-Pil JUNG, Choong-Don YOO, and Seung-Boo JUNG, Japanese Journal of Applied Physics, Vol. 47, No. 5, pp. 4300-4304, 2008
7. Non-PR Bumping and Wafer Stacking by Microsoldering for Electronics, S-J. Hong, J-H. Jeon, H-Y. Lee, J-P.Jung, M. Mayer, Y .Zhou, Materials Science &Technology 2008 Conference & Exhibition
8. Study of fracture mechanics in testing interfacial fracture of solder joints, Bang,W.H., Moon, M.-W., Kim, C.-U., Kang, S.H., Jung, J.P., Oh, K.H., Journal of Electronic Materials, volume 37, No. 4, pp. 417 - 428, 2008