<Year of 2016>

1. Effect of ZrO2 nanoparticles on the microstructure of Al-Si-Cu filler for low-temperature Al brazing applications, Metallurgical and Materials Transactions A, Volume47, Number1, p.510-521, 2016
2. Effect of graphene nanoplatelets on wetting, microstructure, and tensile characteristics of Sn-3.0Ag-0.5Cu(SAC) alloy, Metallurgical and Materials Transactions A, Volume47, Number1, p.494-503, 2016
3. Compressive strength evaluation in brazed ZrO2/Ti-6Al-4V joints using finite element analysis, Ashutosh Sharma, Se Ho Kee, Flora Jung, Yongku Heo, Jae Pil Jung, Journal of Materials Engineering and Performance, Volume 25, Number 5, p. 1722-1728, 2016
4. Microstructure and brazeability of SiC nanoparticles reinforced Al-9Si-20Cu produced by induction melting, Ashutosh Sharma, Dong-Uk Lim, Jae-Pil Jung, Materials Science and Technology, Volume 32, Number 8, p. 773-779, 2016
5. Effect of La2O3 nanoparticles on the brazeability, microstructure, and mechanical properties of Al-11Si-20Cu alloy, Ashutosh Sharma, Myung Hwan Roh, Jae Pil Jung, Journal of Materials Engineering and Performance, Volume 25, Number 8, p. 3538-3545, 2016
6. Fabrication and shear strength analysis of Sn3.5Ag/Cu-filled TSV for 3D microelectronic packaging, Ashutosh Sharma, Do Hyun Jung, Myong Hoon Roh, Jae Pil Jung, Electronic Materials Letters, Volume 12, Number 6, p. 856-863, 2016
7. Thermal shock, shear and insulating characteristics of epoxy embedded SAC 305 solder joints, Ashutosh Sharma, Young Joo Jang, Jang Baek Kim, Jae Pil Jung, Journal of Alloys and Compounds, Volume 704, p. 795-803, 2017
8. Effect of high temperature high humidity and thermal shock test on interfacial intermetallic compounds (IMCs) growth of low alpha solders, Ashutosh Sharma, Santosh Kumar, Do Hyun Jung, Jae Pil Jung”, Journal of Materials Science: Materials in Electronics, in press, Available online March 2017
9. Effect of AlN Nanoparticle Additions on Microstructure, Solderability and Mechanical Properties of Sn-Ag-Cu solder, Dohyun Jung, Ashutosh Sharma, Dong-Uk Lim, Heung Rak Sohn, Jae Pil Jung, Metallurgical and Materials Transactions A, (Minor Revision 2017)
10. Effect of KOH to Na2SiO3 ratio on microstructure and mechanical properties of plasma electrolytic alumina coatings, Ashutosh Sharma, Yong Joo Jang, Jae Pil Jung, Journal of Materials Engineering and Performance, Minor Revision 2017.
11. Effect of brazing current and speed on the microstructure, weld characteristics and mechanical properties of the arc brazed hot-dip galvanized steel sheets using Cu3Si filler, Ashutosh Sharma, Soon Jae Lee, Do Youl Choi, Jae Pil Jung, Journal of Materials Processing and Technology, Minor Revision 2017.
12. Radiation induced errors and low alpha solder bumping solder process in 3-D packaging technology, Do Hyun Jung, Ashutosh Sharma, Jae Pil Jung, Journal of Materials Science (Minor Revision 2017).
13. Flexible Nickel braze (BNi2 grade) for stainless steel brazing, Ashutosh Sharma, Soon-Jae Lee, Jae Pil Jung, (Submission in progress 2017).
14. Recent progress in electroless plating of copper, Ashutosh Sharma, Chu-Seon Cheon, Jae Pil Jung, Journal of the Microelectronics and Packaging Society, Volume 23, Number 4, p. 1-6, 2016
15. Recent Advances in Thermoelectric Power Generation Technology, Ashutosh Sharma, Jun Hyeong Lee, Kyung Heum Kim, Jae Pil Jung, Journal of the Microelectronics Packaging and Society, Under Review, 2017
16. Effect of various factors on the brazed joint properties in Al brazing technology, Ashutosh Sharma, Seung Hyun Lee, Hyung Oh Ban Y.S. Shin, Jae-Pil Jung, Journal of Welding and Joining, Volume 34, Number 2, p. 30-35, 2016