<Year of 2005>

1. Reliability of Sn-8 mass% Zn-3 mass % Bi Lead - free Solder and Zn Behavior, Sun-Yun Cho, Young-Woo Lee,Kyoo-Seok Kim, Young-Jun Moon, Ji-Won Lee, Hyun-Joo Han, Mi-Jin Kim and Jae-Pil Jung, Materials Transactions,Vol. 46. No. 11 (2005) pp. 2322 to 2328
2. Flip Chip Bump Formation of Sn-1.8 Bi-0.8 Cu-0.6 In Solder by Stencil Printing, Jaesik Lee, Jae-Pil Jung, Chu-Seon Cheon, Yunhong Zhou and Michael Mayer, Material Transactions, Vol. 46, No. 11 (2005) pp. 2359 to 2365
3. The Correlation between Stress Relacation and Steady-State Creep of Eutectic Sn-Pb, W.H. BANG, K.H. OH, J.P. Jung, J.W. MORRIS, Jr., and FAY. HUA, Journal of ELECTRONICS MATERIALS, Vol. 34, No. 10, 2005, pp. 1287-1300
4. Bonding Mechanism of Ultrasonic Gold Ball Bonds on Copper Substrate at Ambient Temperature, L. Lum, S. Y. Cho, Y, Zhou, J. P. Jung, 대한 금속재료학회 추계학술대회, 2005년 10월
5. Experimental Study of Ultrasonic Wedge Bonding with Copper Wire, 2005 6th International Conference on Electronics Packaging Technology(Shenzhen, China Aug 31 ~ Sep 2, 2005), IEEE & China Electronics Packaging Society, Y.H. Tian, I. Lum, S. J. Won, S. H. Park, J. P. Jung, M. Mayer, Y. Zhou, " Philips Best Paper Award "
6. Lower Temperature Soldering of Sn-3.5%Ag solder by Sn-Bi Coating, M. J. Kim, J. Lee, N. JHOU, J. P. Jung, S. H. Kim, International Conference on Lead-free Soldering, May 24~26, 2005, Toronto, Ontario, Canada
7. Bonding Mechanism in Ultrasonic Gold Ball Bonds on Copper Substrate, I. Lum, J.P. Jung, and Y. Zhou, Metallurgical and Materials Transactions Volume 36A (2005), No. 5, pp. 1279-1286
8. Fluxless Plasma Bumping of Lead-free Solders  and Joint Reliability with Under Bump Metallization Thickness, Joon Kwon Moon, Y. Zhou and  Jae Pil Jung, Soldering and Surface Mount Technology, Vol 17(2005), No 2 " Highly Commended Award "