<Year of 2013>

1. Mechanical and electronic properties of Ag3Sn intermetallic compound in lead free solders using ab initio atomistic calculation, S.Kumar, J.P.Jung, Mater. Sci. and Eng. B, 178, p.10-21, 2013
2. Wetting behavior and elastic properties of low alpha SAC105 and pure Sn solder, J. of Materials Science - Materials in Electronics, Vol. 24, No. 6, June. 2013, p.1748-1757,
3. High Speed Cu-Ni Filling into TSV for 3-Dimensional Si Chip Stacking, Met. Mater. Int, Vol 19, No.1, pp. 123-128, 2013
4. Electroplating Characteristics of Sn-Bi Microbumps for Low-Temperature Soldering, IEEE Transactions on compo., pack. and manuf. tech., Vol.3, No.4, 2013, p.566-573
5. High-Speed Shear Test for Low Alpha Sn-1.0%Ag-0.5%Cu (SAC-105) Solder Ball of Sub-100-?m Dimension for Wafer Level Packaging, IEEE Transactions on on compo., pack. and manuf. tech., Vol.3, No.3, 2013, p.441-451
6. Non-PR Sn3.5Ag Bumping on a Fast Filled Cu-Plug by PPR Current, IEEE Transactions on compo., pack. and manuf. tech., Vol. 3, No. 4, April. 2013, p.574-580
7. Electrical Characteristics and Thermal Shock Properties of Cu-Filled TSV Prepared by Laser Drilling, Electronic Materials Letters, Vol. 9, No. 4 (2013), pp. 389-392
8. Cu filling of TSV using various current forms for three-dimensional packaging application, Soldering and surface mount technology, Vol25, No.4, 2013
9. Stencil Printing Behavior of Lead-Free Sn-3Ag-0.5Cu Solder Paste for Wafer Level Bumping for Sub-100um size Solder Bumps, Met. Mater. Int, Vol 19, No.5, 2013
10. SOFT ERROR ISSUE AND IMPORTANCE OF LOW ALPHA SOLDERS FOR MICROELECTRONICS PACKAGING, S.Kumar, S.Agarwal, J.P.Jung, REVIEWS ON ADVANCED MATERIALS SCIENCE, 2013, 12, p185-202
11. Reflection characteristics of electroless deposited Sn-3.5Ag for LED lead frames, S.H.Kee, W.J.Kim. J.P.Jung, Surface & Coatings Technology, 2013, 11, p778-783
12. SOFT ERROR ISSUE AND IMPORTANCE OF LOW ALPHA SOLDERS FOR MICROELECTRONICS PACKAGING, REVIEWSON ADVANCED MATERIALS SCIENCE, Vol 34, Issue 2, P185-202, December, 2013
13. Reflection characteristics of electroless deposited Sn-3.5Ag for LED lead frames, Surface & Coatings Technology, Vol 235, P778-783, November, 2013
14. Stencil Printing Behavior of LEAD-Free Sn-3Ag-0.5Cu Solder Paste for Wafer Level Bumping for Sub-100um Size Solder Bumps, METALS AND MATERIALS INTERNATIONAL, Vol 19, Issue 5, P 1083-1090, September, 2013
15. Cu filling of TSV using various current forms for three-dimensional packaging application, Soldering & Surface Mount Technology, Vol 25, Issue 4 , P 209-217, September, 2013
16. Electrical Characteristics and Thermal Shock Properties of Cu-Filled TSV Prepared by Laser Drilling, Electronic Materials Letters Vol 9, Issue 4, P 389-392, July, 2013
17. Mechanical and electronic of Ag3Sn intermatallic compound in lead free solders using ab initio atomisticcalculation, Mater. Sci. and Eng. B, 178, P 10-21, 2013