♠ Leaders for following projects (1996 to date in UOS)

1. Development of high ductility & low melting point nano-dispersion solder paste for automobile electric devices and flexible display, Mar 2019~Dec 2020
2. Effect of plating composition on LME crack behavior of giga steel welding, POSCO, Mar 2018~May 2019
3. Development of power-module bonding material which has low melting point and high operation temperature by TLP bonding, May 2017~Dec 2019
4. Development of Cu filling technology through Si via of wafer unit, Jun 2012~May 2014
5. Development of bonding process & device for 3-Dimension microsystem packaging, Aug 2006~Jul 2011
6. Development of cored solder ball whose thermal shock & mechanical properties are enhanced for applying to suppress automobile electric device's soft error
7. Development of mass production technology for lead-free soldering. Samsung electronics-Ministry of Commerce, Industry and Energy (MOCIE), Dec 2002~Nov 2005
8. A Study on Next Generation High-Integration 3-Dimensional Stacking Packaging,Korea Science and Engineering Foundation, Sept. 2004-Aug 2007
9. Development of anti-oxidation copper wire for electronics, Jan 2005-June 2005
10. Study on micro-impact test for solder joint in electronics, Research Institute of Science and Technology (RIST), Sept 2004-Dec 2004
11. Study on ultrasonic soldering using heat treating tool, RIST, Sept 2004-Nov 2004
12. Study on soldering standardization of solder joint for car electronics, Hyundai Motors, Aug 2002 ~Feb 2003
13. Development of Voc-Free solder paste for fine pitch devices, MOCIE, Apr.2002 ~ Mar. 2004
14. Standardization of solderability test for Pb-free solders, Agency for Technology and Standards - MOCIE, June 2001 ~ May 2003
15. Fabrication of humid absorbing printed circuit board, Aug. 2001~Feb 2002
16. Fluxless micro-soldering of Si-wafer to glass and to Cu using plasma cleaning for MEMS, Dec 1999  Nov 2001, International Project with UK
17. Study on reliability of Micro-BGA solder joint using lead-free solders, KOSEF, Sept 2000~Aug 2003
18. Development of lead-free solder ball for surface mounting in electronics, Mu technology Co.-MOCIE, 2000.12~2003.11
19. Development of fluxless soldering system of Si-wafer using S-based alloys, A&Z Co.-MOCIE, 1999.8~2002.7
20. Development of high precise soldering system with mounting equipment, MOCIE, 1999.8~2001.7
21. Development of brazing technology of stainless steel for semi-conductor facility, Dong-A Co.,1999.6~1999.9
22. Development of N2 Wave soldering process, iltukCo., 1996.1~ 1999.7
23. Development of Reflow soldering technology for N2/Hot air atmosphere iltuk Co., 1997.12~ 2000.2
24. Metallurgical evaluation of laser soldered joint, Korea Institue of Machinery and Metals, 1996.4~1996.12
25. Spot welding characteristics for solder coated copper plate, KOSEF, 1996.11~ 1998.12
26. Fabrication of repaired roller by brazing, UNITEF, 1999.5~1999.11
27. Effect of reflow process parameters on BGA soldering, 1999.5~ 1999.10