<Year of 2017>

1. A review of soft errors and the low α-solder bumping process in 3-D packaging technology, D. H. Jung, A. Sharma, J. P. Jung, Journal of Materials Science, Vol 52, Issue 1, pp 47-65, 2017
2. Thermal cycling, shear and insulating characteristics of epoxy embedded Sn-3.0Ag-0.5Cu (SAC305) solder paste for automotive applications, Ashutosh Sharma, Young-Joo Jang, Jang Baeg Kim, Jae Pil Jung, Journal of Alloys and Compounds, Vol 704, pp 795-803, 2017
3. Effect of high temperature high humidity and thermal shock test on interfacial intermetallic compounds (IMCs) growth of low alpha solders, Ashutosh Sharma, Santosh Kumar, Do-Hyun Jung, Jae Pil Jung, Journal of Materials Science: Materials in Electronics, Vol 28, Issue 11, pp 8116-8129, 2017
4. Effect of KOH to Na2SiO3 Ratio on Microstructure and Hardness of Plasma Electrolytic Oxidation Coatings on AA 6061 Alloy, Ashutosh Sharma, Yong-Joo Jang, Jae Pil Jung, Journal of Materials Engineering and Performance, Vol 26, Issue 10, pp 5032-5042, 2017
5. Effects of AlN Nanoparticles on the Microstructure, Solderability, and Mechanical Properties of Sn-Ag-Cu Solder, Do-Hyun Jung, Ashutosh Sharma, Dong-Uk Lim, Jong-Hyun Yun, Jae-Pil Jung, Metallurgical and Materials Transactions A, Vol 48, Issue 9, pp 4372-4384, 2017
6. Effect of brazing current and speed on the bead characteristics, microstructure, and mechanical properties of the arc brazed galvanized steel sheets, Ashutosh Sharma, Soon-Jae Lee, Du-Youl Choi, Jae Pil Jung, Journal of Materials Processing Technology, Vol 249, pp 212-220, 2017
7. Application of Surface Protective Coating to Enhance Environment-Withstanding Property of the MEMS 2DWind Direction andWind Speed Sensor, Kyu-Sik Shin, Dae-Sung Lee, Sang-Woo Song, Jae Pil Jung, Sensors (Basel)., Vol 17, 2017
8. AISI 304 Steel Brazing Using A Flexible Brazing Foil Fabricated by Tape Casting Method, Ashutosh Sharma, Soon-Jae Lee, Joo-Hee Oh, Jae Pil Jung, Korean J. Met. Mater. Vol 55, pp 836-844, 2017
9. Fabrication of Single Capacitive type Differential pressure sensor for Differential Flow meter, Kyu-Sik Shin, Sangwoo Song, Kyungil Lee, Daesung Lee, Jae Pil Jung, J. Microelectron. Packag. Soc., Vol 24, pp 51-56, 2017
10. Transient Liquid Phase (TLP) Bonding of Device for High Temperature Operation, Do-hyun Jung, Myung-hwan Roh, Jun-hyeong Lee, Kyung-heum Kim, Jae Pil Jung, J. Microelectron. Packag. Soc., Vol 24, pp 17-25, 2017
11. Recent Advances in Thermoelectric Power Generation Technology, Ashutosh Sharma, Jun Hyeong Lee, Kyung Heum Kim and Jae Pil Jung, J. Microelectron. Packag. Soc., Vol 24, pp 9-16, 2017