<Year of 2000>

1. A Study on the Wetting Properties of UBM-coated Si-wafer. Soon-Min Hong, Jae-Yong Park, Chang-Bae Park, Jae-Pil Jung and Choon-Sik Kang. Journal of the Microelectronics & Packaging Society. Vol. 7, No. 2, p. 55-62 (2000)
2. Analysis of Wetting Force of Solder on Side Coated Cu/Cr-Si Substrate Using Wetting Balance Method. Jae Yong Park, Soon Min Hong, Choon Sik Kang and Jae Pil Jung. Journal. Kor. Inst. Met & Mater. Vol. 38, No. 11 (2000)
3. The fluxless Wetting Properties of UBM-Coated Si-Wafer to the Pb-Free Solders. Soon-Min Hong, Jae-Yong Park, Moon Il Kim, Jae-Pil Jung and Choon-Sik Kang. Journal of KWS, Vol. 18, No. 6, December (2000)
4. Study on the soldering of off-eutectic Pb-Sn solders in partial melting state. Jour. of the Microelectronics & Packaging Society. Vol. 7, No. 2 (2000)
5. The fluxless wetting properties of TSM-coated glass substrate to the Pb-free solders. Jour. of the Microelectronics & Packaging Society. Vol. 7, No. 2 (2000)
6. The fluxless wetting properties of  TSM-coated glass substrate to  the Pb-free solders. Jour. of the Microelectronics & Packaging Society, Vol.7, No.2(2000) 
7. Reliability of fine pitch solder joint with Sn-3.5Ag lead-free solder, Jour. of Korea Welding Society, Vol.18, No.3 (2000)  
8. Study on Microstructure of Soldered Joint for micro-BGA with Sn-Ag-Cu solder by Interface Location,Preprints of National meeting of Autumn, Korean Welding Society, Vol.36, pp. 281-283(2000)
9. Fluxless Soldering of Si-wafer/Glass Substrate using Plasma Cleaning,Preprints of National meeting of Autumn, Korean Welding Society, Vol.36, pp. 284-286(2000)
10. Study on the soldering in partial melting state(1) - Analysis of surface tension and wettability. Jour. of Electronic Materials, Vol. 29, No.11(2000)
11. The fluxless wetting properties of TSM-coated glass substrate to the Pb-free solders, Jour. of the Microelectronics & Packaging Society, Vol. 7, No. 2, (2000) Jour. of the Microelectronics & Packaging Society, Vol. 7, No. 2, (2000)
12. A study on the wetting properties of UBM coated Si-wafer.Jour. of the Microelectronics & Packaging Society, Vol. 7, No. 2, (2000)
13. Study on the soldering  of off-eutectic Pb-Sn solders  in partial melting  state. Jour. of the Microelectronics & Packaging Society, Vol. 7, No. 2, (2000)
14. Effect of Cu Containing Solders on Shear Strength of As-soldered BGA Solder Joints, Jour. of the Microelectronics & Packaging Society, Vol. 7, No. 2, (2000)
15. Application of Soldering in Partial Melting Zone to Grid Area Packaging  Using Pb Free Hyper-Eutectic Solder. Annual Meet. of TMS, TN, USA, Feb. (2000)
16. The Possibility of Soldering in Partial Melting Zone Using Hyper-Eutectic Sn-Pb alloys.Annual Meet. of TMS, TN, USA, Feb. (2000)
17. Effect of Plasma Cleaning on the Flip-Chip Bonding Properties of Si-Wafer/Bumps/Glass system. Annual Meet. of TMS, TN, USA, Feb. (2000)
18. Study on calculation of surface tension of solder using wetting curve and its  application to the  prediction of BGA  solder ball shape.  6th sympo. on  Microjoin. and Assembly Tech. in Electronics, Yokohama, Japan, pp.45~ 50, Feb. (2000)
19. The  wetting   properties of   UBM-coated  Si-wafer   to  the  lead-free   solders in Si-wafer/bump/glass flip-chip  bonding system.  Proc. Of  5th Intl    Joint Sympo. On Microelectronics and Packaging, The Intl  Micro. and Pack. Soc., Seoul Korea, pp74-79 , Apr. (2000)
20. Wettability analysis of liquid phase in partial melted solders using wetting balance. Proc. Of 5th Intl Joint Sympo. on Microelectronics and Packaging, The Intl  Micro. and  Pack. Soc., Seoul Korea, pp81-86, Apr.
21. Reaction of alloying element with superficial oxide film of  Al-alloys during Al-diffusion bonding. Proc. of Intl Brazing and Soldering Conf., Amer. Weld. Soc. New Mexico, USA, Apr. (2000)
22. The wetting properties of UBM and TSM-coated layer to the lead-free solders in Si-wafer/glass flip-chip packaging, Preprints of National meeting of Spring, Korean Welding Society, Vol.35, pp.170-173, (2000)
23. A study on the partial melting soldering (1)-Wettability and surface tensions, Preprints of National meeting of Spring, Korean Welding Society, Vol.35, pp.199-202, (2000)
24. A study on the partial melting soldering (2)-microstructure and mechanism, Preprints of National meeting of Spring, Korean Weld. Soc., Vol.35, pp.203 - 206, (2000)
25. The possibility of soldering in partial melting zone using hyper-eutectic Sn-Pb alloys, Spring meeting of the Kor. Inst. of Metals and Materials, Apr. (2000)
26. Application of soldering in in partial melting zone to grid array package  using Pb-free hyper-eutectic solders, Spring meeting of the Kor. Inst. of Metals and Materials, Apr. (2000)
27. Effect of atmosphere on the wetting properties of UBM-coated Si-wafer to the lead-free solder, Spring meeting of the Kor. Inst. of Metals and Materials, Apr. (2000)