<Year of 2009>

1. Ultrasonic bonding of flexible PCB to rigid PCB using an Sn interlayer, Kyoo-Seok Kim, Jae-Pil Jung, Y. Norman Zhou, Soldering & Surface Mount Technology, Vol. 21, Num. 1, pp.4-10, 2009
2. Effects of surface conditions on resistance spot welding of Mg alloy AZ31, L. Liu, S. Q. Zhou, Y. H. Tian, J. C. Feng, J. P. Jung, and Y. N. Zhou, Science and Technology of Welding and Joining, VOL 14, Num 4, pp.656-661, 2009
3. Shear test and underfill filling at Micro pitch for 20μm flip chip, Hee-Yul Lee, Young-Gon Lee, In-Rak Kim, Hyung-Il Choi, Wang-Gu Lee and Jae-Pil Jung, Spring Conference of The Korean Institute of Metals and Materials, April, 2009
4. Effect of the pad geometry to high-speed shear strength, In-Rak Kim, Hee-Yul Lee, Young-Gon Lee, Wang-Gu Lee, Jae-Hyun Park, Jung-Tak Mun and Jae-Pil Jung, Spring Conference of The Korean Welding and Joining Society, May, 2009
5. Study of high speed shear test for SnAgCu solder ball joint with variable UBM, Young-Gon Lee, In-Rak Kim, Hee-Yul Lee, Wang-Gu Lee, Jae-Hyun Park, Jung-Tak Mun and Jae-Pil Jung, Spring Conference of The Korean Welding and Joining Society, May, 2009
6. Study of high speed shear test for SnAgCu solder joint with variable pad finishes, Young-Gon Lee, In-Rak Kim, Wang-Gu Lee, Jae-Hyun Park, Jung-Tak Mun and Jae-Pil Jung, Spring Conference of The Korean Institute of Surface Engineering, May, 2009
7. Fabrication of tapered Via hole on Si wafer for non-defect Cu filling In-Rak Kim, Young-Gon Lee, Wang-Gu Lee and Jae-Pil Jung, Spring Conference of The Korean Institute of Surface Engineering, May, 2009
8. Effects of laser parameters on the characteristics of a Sn-3.5wt.%Ag solder joint, Jeng-O Kim, Jae-Hoon Lee, Jeong-Suh, Hee-Shin Kang and Jae-Pil Jung, Metals and Materials International, Vol15, No1, pp.119-123
9. Finite Element Modeling of Simultaneous Ultrasonic Bumping with Au Balls, Wan Ho Song, Ali Karimi, Yan Huang, Michael Mayer, Norman Zhou, and Jae Pil Jung, Journal of Electronic Packaging, Vol. 131 / 041007-1 ~ 5, DECEMBER 2009
10. Electroplating Characteristics of Sn and Sn-Ag Bumps Formed without PR for 3D Chip Stacking, Jiheon Jun, Inrak Kim, Younggon Lee, Heeyul Lee, Y. Norman Zhou, Jae Pil Jung, Materials Science & Technology 2009 Conference & Exhibition, october 2009