<Year of 2007>

1. Various phases formation and reliability of Sn-8Zn-3Bi solder, J.P.Jung, Y.W.Lee, S.Y.Cho, M.J.Kim, N.Zhou, SMTA International Conference on Soldering and Reliability, April 17-19, 2007, Toronto, Canada, April.
2. Fabrication of fine Sn-Cu Solder Bump with straight wall type Formed By Electroplating, Ki-Ju Lee, Kyoo-seok Kim, Sung-Jun hong, Hee-yul Lee, Ji-Heon Jhun, In-Heo Kim, Jae-Pil Jung, The korean Institute of surface engineering, April
3. Ultrasonic soldering of Si-wafer for flip chip with Sn-3.5Ag, J.S.Lee, J.P.Jung, N.Zhou, SMTA International Conference on Soldering and Reliability, April 17-19, 2007, Toronto, Canada, April
4. Formation of Through-Hole and Cu-Filling for 3 Dimensional Packaging Technology, Sung-Jun Hong, Ji-Hun Jun and Jae-Pil Jung, Journal of KWJS, Vol. 25, No. 2 pp.24-30, April, 2007, April
5. Reliability of Sn-8Zn-3Bi Solder Joint and Low Melting Point Phase Y. W. Lee, S. J. Hong, K. J. Lee, and J. P. Jung (Univ. of Seoul, Korea), IWJC2007 p.155, May
6. Ultrasonic Bonding of FPCB and Rigid PCB at Ambient Temperature, K.S. Kim, K.J. Lee, S.J. Hong, and J.P. Jung (Univ. of Seoul, Korea), IWJC2007 pp.164-165, May
7. Bending Fatigue Characteristic of Sn-3.5Ag Solder bump on Ni-UBM, Kyong-In Kang(MKE), Jea-Pil Jung(Univ. of Seoul, Korea), Woong-Ho Bang(Seoul natl. Univ.), Ji-Ho Park(RIST), K.H. Oh(Seoul natl. Univ.), IWJC2007 p.151, May
8. Effect of Laser Parameter on the Bond Characteristics of Sn-3.5%Ag Solder Ball, Jeng O Kim (KIMM, Korea), Jae Pil Jung (Univ. of Seoul, Korea), Jae Hoon Lee, Jeong Suh, and Hee Shin Kang (KIMM, Korea), IWJC2007 pp.496-497, May
9. Formation of Metal Electrode by Electroless Plating on BLU for LCD, Seong Joon Hong (LG Electronics, Korea), Chu Seon Cheon, (Danyang Soltec CO., Ltd., Korea), and Jae Pil Jung (Univ. of Seoul, Korea), IWJC2007 pp.502-503, May
10. Study of through hole formation and electroconductive material filling for three dimensional stack packaging, Sung-Jun Hong, Ki-Ju Lee, and Jae-Pil Jung, Korean Society of Machine Tool Engineers, KSMTE spring conference2007 pp42-47, May
11. 3-Diemensional Stack Packaging -Direct Bumping without PR-, Sung-Jun Hong, Jae-Pil Jung (Univ. of Seoul, Korea), KWJS, MPC2007, Octorber
12. Non-PR direct bumping for 3D wafer stacking, Ji-Heon Jhun, Sung-Jun Hong, Ki-Ju Lee, Hee-Yul Lee, Jae-Pil Jung (Univ. of Seoul, Korea), IMAPS-Korea, 2007 Fall Meeting Abstracts p.55, Octorber
13. The effect of clamping condition on melting efficiency of high speed plasma arc welding for EGI sheet, Sung-Jun Hong, Jae-Pil Jung, Young-Duk Moon, Sang-Myoung Jho, KWJS, Proceeding of the 2007 Autumn Annual Meeting of Korean Welding and Joining Society Vol. 48 pp. 88-90, Octorber
14. Fabrication of fine Sn-0.7wt%Cu Solder Bump Formed by Electroplating, Ki-Ju Lee, Hee-Yul Lee, Ji-Heon Jhun, In-Hoe Kim, Jae-Pil Jung, KWJS, Proceeding of the 2007 Autumn Annual Meeting of Korean Welding and Joining Society Vol. 48 pp. 227-228, Octorber
15. Non-PR direct bumping for 3D wafer stacking, Ji-Heon Jhun, Sung-Jun Hong, Ki-Ju Lee, Hee-Yul Lee, Jae-Pil Jung, KWJS, Proceeding of the 2007 Autumn Annual Meeting of Korean Welding and Joining Society Vol. 48 pp. 229-231, Octorber
16. Reduced temperature soldering of capacitors using Sn-Bi plated Sn-3.5%Ag, Mi Jin Kim, Y.(Norman) Zhou, Jae Pil Jung, SSMT, Soldering & Surface Mount Technology 2007 Vol. 19 pp. 3-8, November
17. Pb-free Solder-Bumping for Flip Chip and 3D Packaging, Jae-Pil Jung, SSF2007, International Workshop on Urban Environmental Science and Technology pp.64-66, December