<Year of 2004>

1. Plasma Reflow Bumping of Sn-3.5 Ag Solder for Flux-Free Flip Chip Package Application. Hong, S. M., Kang, C. S., Jung, J.P, IEEE Transactions on Advanced Packaging, Vol 27, No 1,2004, p90 ~ 96
2. Fluxless plasma Pb-free soldering of Si-wafer Effect of plasma cleaning, Jour. Of Microelectronics and packaging Soc., Vol.11 No.1, (2004), p77~85
3. Microstructure and Strength of Sn-Bi Caoted Sn-3.5mass%Ag Solder alloy, Material Transactions Vol.45 No.3, March 2004, p783~798
4. Fluxless Plasma Soldering of Pb-free Solders, J. K. Moon, J. P. Jung, Y. Zhou, K. I. Kang, J. S. Lee. Proceeding of 85th American Welding Society Annual Meeting, pp.46-47, Apr.6-8, 2004, Chicago, IL, USA
5. Characteristics and Reliability of SnBi Coated Lead-free Solder Ball. J. S. Lee, J. P. Jung, W. H. Bang, K. H. Oh, Y. Zhou. 134th Annual meeting of TMS, Mar. 14-18, 2004, Charlotte, NC, USA
6. Thermal impact characteristics of QFP-lead solder joint, Symposium Proceedings of Micro- electronics and packaging Soc., (2004), Nov.
7. Study of lower temperature soldering of Sn-3.5Ag solder, Symposium Proceedings of Micro-electronics and packaging Soc., (2004), Nov.
8. Reliability and behavior of Sn-8Zn-3Bi solder, Symposium Proceedings of Micro- electronics and packaging Soc., (2004), Nov.
9. Evalution of the solerability and joint properties of a new Sn-Cu-Bi-In solder, J. P. Jung, J. M. Kim, J. S. Lee, J. H. Park, S. Cheon, J. W. Park, J. O. Lee, ASM Materials Solutions Conference, Oct 18~21, 2004, Columbus, OH, USA
10. Analysis of Stress Relaxation Characteristic of Chilled Eutectic Sn-Pb Solder, W. H. Bang, M. W. Moon, K. H. Oh, J. P. Jung, J. W. Morris, ASM Materials Solutions Conference, Oct 18~21, 2004, Columbus, OH, USA<
11. Joint strength of Sn-8Zn-3Bi solder with PCB surface treatment, Korea Insti. Of Metals & Materials, Annual meeting in autumn, (2004), Oct.
12. Effect of Plasma Cleaning on Fluxless Plasma Soldering of Pb-free Solder Balls on Si-wafer. Joon Kwon Moon, Kyung In Kang, Jae Pil Jung, Yun Hong Zhou. Material Transactions Vol.45 No.6. June 2004, p1880-18885
13. Effect of plated layer of PCB on the reliability of Sn-3Ag-0.5Cusolder, proceeding of Spring meeting,Korea welding society, (2004), May
14. Fabrication and Solderability of SnBi coated Sn3.5wt%Ag solder, Jour. OfKorea Insti. Of Metals & Materials, vol.42, No.5
15. Application of TLP bonding method to the high Tm lead-free solder, Materials Science Forum, Vol 475-479 (2005) pp.1869-72