<Year of 2015>

1. Lower Protrusion of a Copper-Nickel Alloy in a Through-Silicon via and Its Numerical Simulation, 1. Materials Transactions, Vol 56, Issue 12, p.2034-2041, 2015
2. Sn-Ag-Cu to Cu Joint Current Aging Test and Evolution of Resistance and Microstructure, Electronic Materials Letters, Vol 11, Issue 6, p.1078-1084, 2015
3. Electromigration of Composite Sn-Ag-Cu Solder Bumps, Electronic Materials Letters, Vol 11, No. 6, p.1072-1077, 2015
4. Extrusion Suppression of TSV Filling Metal by Cu-W Electroplating for Three-Dimensional Microelectronic Packaging, METALLURGICAL AND MATERIALS TRANSACTIONS A, Vol 46, Issue 5, p.2051-2062, 2015
5. Effect of current density on morphology of electroplated tin, Surface Engineering, Vol 31, Issue 6, p.458-494, 2015
6. Effect of Soldering Temperature on Wetting and Optical Density of Dip Coated Sn and Sn-3.5Ag Solders, Materials and Manufacturing Process, Vol 30, Issue 1, p.127-132, 2015
7. Effect of Current Density and Plating Time on Cu Electroplating in TSV and Low Alpha Solder Bumping, J. of Materials Engineering and Performance, Vol 24, Issue 3, p.1107-1115, 2015
8. Influence of La2O3 nanoparticle additions on microstructure, wetting, and tensile characteristics of Sn-Ag-Cu alloy, Materials and Design, Vol 87, p.370-379, 2015
9. High Shear Speed Characteristics of Sub-100 mm Low Alpha SAC105 Solder Bump Directly Fabricated on Cu Filled Through Si Via for 3D Integration, J. of Microelectronics and Electronic Packaging, Vol 12, Issue 3, p.161-169, 2015