<Year of 1999>

1. Effect of Dxide Morphology on Bond Strength of Diffusion-Bonded Interfaces of Al-Alloys. Keiko KOTANI, Jae-Pil Jung, Kenji IKEUCHI and Fukuhisa MATSUDA. Trans. JWRI. Vol. 28,No. 2, (1999)
2. Effect of Sulphur on the Shape of Weld Bead, Journal of the Institute of Industrial Technology, Vol. 7, pp. 9~14, 1999
3. A Study on Solderability by Lasting time of PCB in Pre-Baking, Journal of the Microelectronics &Packaging Society, Vol. 6, No. 1, p.59~64, 1999
4. K. Kotani, J.P.jung, K.Ikeuchi, F.Matsuda, Interfacial phases indiffusion bonded joints of Al-binary alloys by transmission Electron Microscope, Trans, JWRI, Vol. 27, No. 2, pp37-45
5. B.Y.Ahn,J.P.Jung,T.Takemoto : Brazing Technology for Heat Exchangers. Journal of Korean Welding Society. Vol.17. No.2, p.9~17 (1999)
6. M.K.Choi,C.Y.Lee,J.P.Jung,C.J.Shur : A Study on Wettability and Defects Behavior of Flow-soldered Joint using Low Residue Flux. Journal of Electronics Manufacturing. Vol.9. No.3 (1999)
7. Jae Yong Park, Jae Pil Jung, Choon Sik Kang : The Analysis of the Withdrawal Force Curve of the Wetting, IEEE Trans. on Component and Packaging Technology, Vol.22.No.3, (1999)
8. J.Y.Park, C.S.Kang, J.P.Jung : The Analysis of the Withdrawal Force Curve of the Wetting Curve Using 63Sn-37Pb and 96.5Sn-3.5Ag Eutectic Solders, Journal of Electronic Materials, Vol.28, No.11(1999)
9. Keiko Kotani, Jae-Pil Jung, Kenji Ikeuchi, and Fukuhisa Matsuda : Improvement in Bond Strength of Diffusion-Bonded Al-Alloy Joint through Mg Addition. 5th IIW, July 19th~24th, Lisbon,Portugal(1999)
10. J.P.Jung : A Study on the Solderability of QTP Outer Lead Using Nd:YAG Laser. METALS AND MATERIALS, Vol. 5, N.3(1999), pp.317~321
11. C.B.Park,M.J.Kim,J.P.Jung : A study on Resistance Spot Welding of Cu sheet plated with Sn-37%Pb. 1999 spring Meeting Abstract of the Korean Institute of Metals and Materials pp. 125
12. H.J.Han,J.P.Jung,J.Y.Park,C.S.Kang,B.Y.Ha,Y.E.Shin : Metallurgical properties of Sn-Pb/Sn-Ag eutectic solder ball using BGA process. 1999 spring Meeting Abstract of the Korean Institute of Metals and Materials. pp. 139
13. J.Y.Park,C.S.Kang,H.J.Han,J.P.Jung : Measurement of surface tension by meniscograqh using Sn-Pb/Sn-Ag eutectic solder. Preprints of the national meeting of spring 1999 of The Korean Institute of metals and Materials pp. 139
14. J.P.Jung : A Study on the tensile strength of flow-soldered joint using low residue flux.Journal of The Korea Welding Society vol.17.No.1(1999)
15. J.Y.Park, J.P.Jung, C.S.Kang, Y.E.Shin : Analysis of wetting balance test-Part 1 : The Effect of lmmersion Depth, 5th symposium on Microjoining and Assembly Technology in Electronics, February 4-5, Yokohama.1999.2
16. J.Y.Park, J.P.Jung, C.S.Kang : Analysis of upper peak in the wetting balance curve, Annual of TMS.Sandiago. 1999.3
17. H.J.Han, J.P.Jung,B.Y.Ha, Y.E.Shin, J.Y.Park, C.S.Kang : Study on reflowed solder joint properties of QFP using Sn-Pb, Sn-Ag solder paste, Annual Meeting of the Korean Institute of Metals and Materials(1999), p.213
18. C.B.Park, J.P.Jung, S.M.Hong, C.S.Kang : A study on the Si-wafer/Glass bonding using Sn alloy solders, Annual Meeting of the Korean Institute of Metals and Materials(1999), p.211
19. J.Y.Park, C.S.Kang, H.J.Han, J.P.Jung : A study on the analysis of wetting forces in the wetting balance test, Annual Meeting of the Korean Institute of Metals and Materials(1999), p.210
20. S.M.Hong, J.Y.Park, C.S.Kang, C.B.Park, J.P.Jung : A study on the wetting properties of Sn alloy solders to the Si and Glass substrates, Annual Meeting of the Korean Institute of Metals and Materials(1999), p.211
21. H.J.Han, J.Y.Park, J.P.Jung, C.S.Kang : Effetc of Reflow Variables on the Characteristic of BGA Soldering, Journal of the Microelectronics & Packaging Society, Vol.6. No.3, 1999
22. C.B.Park, M.J.Kim, J.P.Jung : A study on Resistance Spot Welding of Cu sheet plated with Sn-37%Pb, Journal of the Microelectronics & Packaging Society, Vol.6. No.3, 1999
23. H.J.Han, J.P.Jung, Y.E.Shin, J.Y.Park, C.S.Kang : Micro-Soldering Technology in Electronic Industry, Bulletin of the Korean Institute of Metals and Materials, Vol.12, No.6
24. M.K.Choi,C.Y.Lee,J.P.Jung,C.J.Shur,Y.E.Shin : A Study on Wettability and Defects Behavior of Flow-soldered Joint using Low Residue Flux. Journal of Korean Welding Society. vol.16.No.6(1998)
25. J.P.Jung : Effects of gas formers of flux cored wire on spattering. Journal of Korean Welding Society. vol.16.No.5(1998)
26. J.P.Jung,M.K.Choi,Y.E.Shin,C.J.Shur,S.S.Im : Comparison of Wave Solderbility Using Cleaning and Non-Cleaning Fluxes.Preprints of the national meeting of autumn of The IMAPS-Korea 57~60(1998)
27. H.J.Han,J.P.Jung,H.K.An,Y.E.Shin,C.S.Kang,J.Y.Park : Reflow Soldering Characteristics Using Sn-Pb and Sn-Ag Eutectic Solders.Preprints of the national meeting of autumn of The Korean Welding Society 141~142 (1998)
28. J.P.Jung : A Study on the Spattering Mechanism by Pore Evolution. Journal of the Institute of Industrial Technology, Vol.6, No.2, pp.43~47, 1998
29. H.J.Han, J.P.Jung : An analysis of a crack on the plate type heat exchanger of stainless steel. Journal of the Institute of Industrial Technology, Vol.6, No.1, pp.89~93, 1998
30. G.H.Sin, M.K.Choi, J.P.Jung, C.J.Shur : A study on Solderability by Lasting time of PCB in Pre-Baking.Journal of the Microelectronics & Packaging Society, Vol.6. No.1, p.59~64, 1999
31. Y.E.Shin,J.M.Kim,J.P.Jung : A Study on the Life Prediction & Quality Improvement of Joint in IC Package.Preprints of the national meeting autumn of The Korea Welding Society pp.147~150 (1998)
32. H.J.Han,J.P.Jung,H.K.An,Y.E.Shin,J.Y.Park,C.S.Kang,B.H.Lee : Metallurgical Properties of Sn-Pb/Sn-Ag eutectic solder ball using BGA process.Preprints of the national meeting spring of The Korea Institute of metals and materials. pp.84 (1998)
33. Y.E.Shin,J.P.Jung,Nakada,S.B.Jung : Stress Analysis and Life Improvement of Solder Joint in TSOP with Clad Lead Frame. Japan Welding Society(4th Symposium on Microjoing and Assembly in Electronics).(1998 )
34. J.P.Jung, C.S.Kang:Transient Liquid Phase process in Ni-B joining. Material Transactions,JIM Vol.38, No.10 (1997)
35. Keiko KOTANi,J.P.Jung,Kenji IKEUCHI,Fukuhisa MASUDA:Interfacial Phases in Diffusion-Bonded Joints of Al-X Alloys(X=Mg,Si,Mn,Zn,Cu).Quarterly Journal of theJapan Welding Society vol.15,no.2 352-358.(1997)
36. Y.H.Han,I.U.Kim,J.P.Jung : Development of laser soldering technology for packaging using Beam scanner.Machinery and Materials vol.9,no.1 (1997)
37. J.H.Ok,I.C.Jang, Y.E.Shin,M.K.Choi,C.J.Shur,J.P.Jung,S.H.Hwang : A Study on Initial Strength of Wave Soldering with Low-residue Flux.Preprints of the national meeting autumn of The Korea Welding Society pp.29~32 (1997)
38. M.K.Choi,J.H.Kim,C.Y.Lee,C.J.Shur,J.P.Jung,Y.E.Shin : A Study on defect behavior and characteristic of solder jointed zone.Preprints of the national meeting spring of The Korea Welding Society pp.5~8 (1997)
39. Y.H.Han,I.U.Kim,J.P.Jung : Develoment of laser soldering technology for QFP lead.Preprints of the national meeting spring of The Korea Welding Society pp.165~167 (1997 )
40. I.C.Jang,J.H.Ok,Y.E.Shin,J.P.Jung,M.K.Choi,C.J.Shur : A Study on Wave Soldering using low residue flux(2).Preprints of the national meeting spring of The Korea Welding Society 162~164 (1997 )
41. J.H.Kim, M.K.Choi,J.P.Jung, Y.E.Shin, C.J.Shur : A Study on Wave Soldering using low residue flux(1).Preprints of the national meeting spring of The Korea Welding Society pp.159~161 (1997 )
42. J.P.Jung, C.S.Kang Liquid phase diffusion bonding of Rene80 using pure boron. Material Transactions,JIM Vol.37, No.5 (1996)
43. Keiko Kotanii,J.P.Jung,Kenji Ikeuchi,Fukuhisa Matsuda : Interfacial Phases in Joints of Al-X(X=Si,Mn,Zn,Cu) Binary Alloys Diffusion-Bonded with Al-Mg Filler Sheet. Preprints of The National meeting of J.W.S No.59 256-257 (1996)
44. Keiko Kotanii,J.P.Jung,Kenji Ikeuchi,Fukuhisa Matsuda : Interfacial Phases in Diffusion-Bonded Joints of Al-Ca Binary Alloys Filler Sheet. Preprints of The National meeting of J.W.S. No.59 258-259 (1996)
45. C.H.Jung, M.H.Kim, J.P.Jung, H.H.Cho : A study on the casting and characteristics of near net-shape Al-Si alloy welding rods by the OCC process.Preprints of The National meeting of Korea Foundary Society .(1996)
46. J.P.Jung, C.S.Kang. : A Study on the Bonding Mechanismof Ni/B/Ni System and Its Application. Journal of the Korean institute of metals and materials Vol.34, No.5 (1996)
47. Y.H.Han,J.O.Kim,J.Suh,J.P.Jung,I.W.Kim,J.H.Park : Application of laser and electron beam welding.Proceedings of the 6th Symposium on Laser Materials Processing Daejeon, Korea 23 November 1995.pp.49~68
48. J.P.Jung, T.Takemoto, C.S.Kang : Brazing Technology and Trend in Japan(3)-Non-corrosive Flux Brazing of Aluminum.Journal of Korean Welding Society Vol.13, No.2 (1995)
49. J.P.Jung, T.Takemoto and C.S.Kang : Brazing Technology and Trend in Japan(2)-Aluminum Vacuum Brazing in Japan.Journal of Korean Welding Society Vol.13, No.1 (1995)
50. J.P.Jung, C.S.Kang : Liquid Metal Formation  on Ni/B/Ni Diffusion Bodned Joint. Journal of the Korean institute of metals and materials Vol.33, No.10 (1995)
51. J.P.Jung, C.S.Kang : A Study on the Width of Liquid Layer of Ni/B/Ni Diffusion Bonding System. Journal of Korean Welding Society Vol.13, No.4 (1995 )
52. J.P.Jung, C.S.Kang : Mechanical Property of Liquid Phase Diffusion Bonded Joint of Rene80/B/Rene80. Journal of Korean Welding Society. Vol.13, No.3 (1995)
53. J.P.Jung, C.S.Kang : Liquid Phase Diffusion Bonding Procedure of Rene80/B/Rene80 System. Journal of Korean Welding Society. Vol.13, No.2 (1995 )
54. J.P.Jung, C.S. Kang, Y.J.Park and S.H.Hang : Brazing Technology and Trend in Japan(1) -Aluminum Brazing.Journal of The Korean Welding Society. Vol.12, No.4 (1994)
55. S.T.Park, J.P.Jung and C.J.Suhr : Weldabilities of 7000 Aluminium Alloys(Ⅲ).Journal of The Korean Welding Society. Vol.12, No.3 (1994)
56. S.T.Park, J.P.Jung and C.J.Suhr : Weldabilities of 7000 Aluminium Alloys(Ⅱ).Journal of The Korean Welding Society. Vol.12, No.2 (1994)
57. S.T.Park, J.P.Jung and C.J.Suhr : Weldabilities of 7000 Aluminium Alloys(Ⅰ).Journal of The Korean Welding Society. Vol.12, No.1 (1994)
58. R.Killing, S. H. Hwang, J.P.Jung and Y.J.Park : Effect of Shielding Gas on the MAG Welding Characteristics and Cost Reduction.Journal of The Korean Welding Society. Vol.12, No.1 (1994)
59. J.P.Jung, C.D.Lee and C.S.Kang : A Study on the Melting Induced Diffusion Bonding of 304 stainless steel. Journal of The Materials Research Society of Korea. Vol.31, No.3 (1993)
60. W.C.Lee, C.S.Kang, J.P.Jung and B.Y.Lee : Effect of Sn and P on the Shear Strength of Copper to Stainless Steel Brazed Joints(Ⅱ).Journal of The Materials Research Society of Korea. Vol.3, No.6 (1993)
61. W.C.Lee, C.S.Kang, J.P.Jung and B.Y.Lee : Brazability between  Cemented Titanuim Carbide and 304 Stainless Steel.Journal of The Korean Institute of Metals of Materials. Vol.30, No.9 (1992)
62. An analysis of a crack on the plate type heat exchanger of stainless steel.Journal of the Institute of industrial technology.vol2.(1998)
63. A Basic Study for High Speed MAG Welding.Theses of University of Seoul vol1.(1997)