|
<Year of 2003>
- Fluxless Wetting Properties of UBM-Coated
Si-Wafer to Sn-3.5wt% Ag Solder. Hong, Jae-Yong Park, Choon-Sik Kang, and Jung,
IEEE Transaction on Components and packaging technologies, VOL. 26, No 1, 2003
- Fabrication of solder bump using Sn-Cu
electro-plating for flip chip, Jour. Of Microelectronics and packaging Soc.,
Vol.10 No.4, , (2003), p39~46
- Fluxless plasma soldering with different
thickness of UBM-layers on Si-wafer, Jour. Of Kor. Inst. Of SurfaceEng., vol.36,
no.5, p373~378
- Study on the characteristics of
electroplated soldr, Jour. Of Kor. Inst. Of SurfaceEng., vol.36, no.5, p386~392
- Fluxless Plasma soldering of Pb-free
Solders on Si-wafer. Jae-Pil Jung, Joon-Kwon Moon, Soon-Min Hong, TMS 2003
132nd Annual meeting and exhibition, San diego, USA, 2003
- Pb-free solder bumping for flip chip
package by electroplating. Hwang, Soon-Min Hong, Jae-pil Jung, Choon-sik Kang.
Soldering & Surface Mount Technology, Vol. 15 No.2 2003, p10~16
- Effect of coated thickness on Al brazing,
Jour. of Industrialinstitute ofUniv. ofSeoul,
vol.11, (2003), p109~112
- Strength and microstructure of SnBi and
Bi-coated Sn-3.5%Ag solder, Korea Insti. Of Metals & Materials, Annual
meeting in autumn, (2003), Oct. (selected as excellent poster paper)
- Reflow soldering and inspection, Surface
mount technology, May. 2003, p43~49
- Solder defects and defectless soldering,
Surface mount technology, April. 2003, p73~80
- Design of PCB and soldering, Surface mount
technology, Mar. 2003, p23~30
- Introduction of soldering and fluxing,
Surface mount technology, Feb. 2003, p42~48
- Reliability tests of solder joints (I), J.
of Korea welding soc., vol.21, no.3,p.273-277
* other papers in conference proceedings; 8papers
|
