♠ Research Projects

1. Micro-soldering & strength properties of Sn-base solder, 2018.5~2019.4
2. Research of bonding properties of Sn-base bonding meterial, 2016.5~2017.4
3. Bonding properties & electroplating of Sn-base matal for high density packaging, 2013.5~2014.4
4. Properties of Si chip bonding with Sn-base solder bump, 2010.5~2011.4
5. Effect of trace element to properties of Pb-free Sn solder, 2008.5~2009.4
6. Low temperature soldering to capacitor with Sn-Bi electroplated Sn-3.5%Ag, 2006.5~2007.4
7. A Trend & Technology of Pb-free microsoldering,Dong-bu electronics Co..2000.9.6
8. Development of fluxless soldering system for Si-wafer. Ministry of Commerce, Industry and Energy 1999.8~2002.7
9. Development of automatic solder ball mounter and soldering system Development of soldering process, Ministry of Commerce, Industry and Energy, 1999.8~2001.7
10. A Study on Sn alloy composition for heat resistance with industry, 1999.8~1999.10
11. Development of brazing technology of stainless steel unit for electronics with industry, 1999.6~1999.9
12. Development of Processing technology for N2 Wave soldering with industry. 1996.1~ 1999.7
13. Development technology of reflow soldering with N2/Hot air condition. MCIE.1997.12~ 2000.2
14. Evaluation of metallugical characteristics on Laser soldered joint. 1996.4~1996.12
15. A study on the spot welding characteristics of Cu sheet plated with solders.1996.11~ 1998.12
16. Development of brazing technolory for repairing rollers. 1999.5~1999.10
17. Effect of reflow variables on the characteristec of BGA soldering.1999.5~1999.10
18. Fluxless Micro-soldering for MEMS, International project with Salford Univ. Uk. 1999. 12~2001.11