<Year of 2002>

1. Fluxless Sn-3.5mass%Ag Solder Bump Flip Chip bonding by Ultra-Sonic Wave. Soon-Min Hong, Choon-Sik Kang, Jae-Pil Jung. Material Transaction. Vol.43, No6. p 1336-1340
2. Fluxless Bonding of solder Bump Flip Chip to Glass Substrate Using Ultra-Sonic Wave.
3. Soon-Min Hong, Choon-Sik Kang, and Jae-Pil Jung. 8th Symposium on "Microjoining and Assembly Technology in Electronics" January 31-Fabruary 1, 2002,Yokohama
4. Flux-free Direct Chip Attachment of Solder-Bump Flip Chip by Ar+H2 Plasma Treatment. Soon-Min Hong, Choon-Sik Kang, and Jae-Pil Jung. Journal of Electronic Materials, Vol. 31, No.10, 2002
5. Shear Strenth and Interfacial Compound of Sn-Ag-Bi-In Alloy. Moon-Il Kim, Joon-Kwon Moon, and Jae-Pil Jung. Material Transaction, Vol.40 No.8 (2002) pp.1791-1796
6. Possibility of Partial melting soldering process with off-Eutectic Lead free Solder alloys. Coon-Sik Kang, Jun-Seok Ha,Jae-Yong Park, Jae-Pil Jung. Proceeding of The International Welding /Joining Conference-Korea 2002, Oct, 28-30, 2002
7. Fluxless Thremosonic Boding of Sn-3.5Ag Solder Bump Flip Chip. Soon-Min Hong, Choon-Sik Kang, and Jae-Pil Jung. J. of Kor. Inst. Met. & Mater
8. A Study on the fluxless lead-free Soldering by Plasma Treatment. Joon-Kwon Moon. Kyung-In Kang, Jea-Pil Jung. Journal of TheInstitute ofInformation and Technology. Vol.4 pp. 20-23 Aug. 2002
9. A Study on The Fabrication of Fluxless Solder Bump Flip Chip Pakage by using Ar and H2 Gas Mixture Plasma Reflow. Soon-Min Hong, Choon-Sik Kang, and Jae-Pil Jung. J. of kor. Inst. Met. & Mater. Vol. 40, No.10 (2002)
10. A Study on The of Intermetallic Compound and Shear Strength of Sn3.5Ag0.7Cu ball with Interface Position. K.S. Shin,J.H. Park, J.P. Jung. Journal of The Korea Institute of Surface Engineering Vol. 35, No. 1, Feb. 2002. pp.47-52
11. Study on The Fabrication of Flip Chip Lead-free Solder Bump by Electroplating. Hyeon Hwang, Soon-Min Hong, Choon-Sik Kang and Jae-Pil Jung. J. of Kor. Inst. Met. & Mater. Vol. 40, No. 1 (2002)
12. A Study on The Characteristics of Sn-Ag-X Solder Joint. Moon-Il Kim, Joon-Kwon Moon, and Jae-Pil Jung. Journal of TheKorea Welding Society. Vol.20 No.2 (Apr 2002)
13. A Study on The Soldering Characteristics of Sn-Ag-Bi-In Ball In BGA. Joon-Kwon Moon, Moon-Il Kim and Jae-Pil Jung. Journal of TheKorea Welding Society. Vol.20 No.4 (Aug 2002) pp.99-103
14. A Study on Solderability of Sn-Ag-Cu Solder With Plated Layers in -BGA. Kyu Sik Shin, Seok Won Jung and Jae-Pil Jung. Journal of TheKorea Welding Society. Vol.20 No.6 (Dec 2002) pp.59-64
15. Effect of Plasma Treatment on The Bond Strength of Sn-Pb Eutectic Solder Flip Chip. Soon-Min Hong, Choon-Sik Kang and Jea-Pil Jung. Journal of TheKorea Welding Society. Vol. 20, No. 4, Aug, 2002 pp.92-98
16. A Study on The Comparision of Solderability Assessment. B.Salam, N.N. Ekere and J.P. Jung. Journal of theinstitute ofSurface Engineering. Vol.35, No2. 2002. pp. 129-137
17. A Study on The Characteristics of Sn-Ag-X Solder Joint-The Wettability of Sn-Ag-Bi-In Solder to Plated Substrates- M.I.Kim, J.K.Moon and J.P.Jung. Journal of The Korea Institute of Surface Engineering Vol.35 No. 1, Feb. 2002
18. The Influence of Intermetallic Compounds on The Interfacial Reaction and Wetting Property in Flip Chip Pacage. Moon-Il Kim, Joon-Kwon Moon, Jae-Pil Jung. Journal of The Korea Institute of Surface Engineering Vol. 35, No. 1. Feb. 2002
19. Testing and Inspection on Solder and Solder Joint. Kyung- In Kang, Kye-Hwan Kwak, Jae Pil Jung,Jae-Hyun Park and Jong Ku Yoon. Journal of TheKorea Welding Society.Vol. 20, No. 3. Jun. 2002. pp. 9-15
20. Evaluation of Metallurgical Characteristics and Strength on Soldered Joint. Jae Sik Lee, Jae Pil Jung, and Sook Hwan Kim. Journal of TheKorea Welding Society. Vol.20, No.4, Aug 2002 p31-5

* Number of other papers in conferences: 14