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  Award “A Distinguished Fellow” by the Royal Academy of Engineering,
   UK, and Lecture tours in UK universities, 2017

  Academic Award for Lifetime Achievement, Korea Welding & Joining
   Society, 2015

  Best Paper Award, Korea Microelectronic and Packaging Society, 2016

  Best Paper Award, Korea Institute of Metals & Materials, 2013

  Highly Commended Award, Soldering & Surface Mount Technology,
   UK, 2006, 2013

  100 Leaders for Korean Future in the year of 2020

  Collaboration Lab with Hyundai car group

 

  Researches for 3D Microsystem packaging procedure

  Sn-Cu electroplating process

  Researches for high-density 3D packaging procedure

  Development for Pb-free solder

  Ultrasonic using solderless flipchip procedure

 
  copyright 2006 Micro-joining lab. all right reserved.
University of Seoul, Department of Materials Science and Engineering 90, Junnong-dong, Tongdaemun-ku, Seoul 130-743, KOREA
Tel. 02) 2210-2759 Fax. 02) 2215-5863