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    ÇØ¿ÜÇмúÁö - SCI(E) µîÀç
  • Lower Protrusion of a Copper-Nickel Alloy in a Through-Silicon via and Its Numerical Simulation, 1. Materials Transactions, Vol 56, Issue 12, p.2034-2041, 2015
  • Sn-Ag-Cu to Cu Joint Current Aging Test and Evolution of Resistance and Microstructure, Electronic Materials Letters, Vol 11, Issue 6, p.1078-1084, 2015
  • Electromigration of Composite Sn-Ag-Cu Solder Bumps, Electronic Materials Letters, Vol 11, No. 6, p.1072-1077, 2015
  • Extrusion Suppression of TSV Filling Metal by Cu-W Electroplating for Three-Dimensional Microelectronic Packaging, METALLURGICAL AND MATERIALS TRANSACTIONS A, Vol 46, Issue 5, p.2051-2062, 2015
  • Effect of current density on morphology of electroplated tin, Surface Engineering, Vol 31, Issue 6, p.458-494, 2015
  • Effect of Soldering Temperature on Wetting and Optical Density of Dip Coated Sn and Sn-3.5Ag Solders, Materials and Manufacturing Process, Vol 30, Issue 1, p.127-132, 2015
  • Effect of Current Density and Plating Time on Cu Electroplating in TSV and Low Alpha Solder Bumping, J. of Materials Engineering and Performance, Vol 24, Issue 3, p.1107-1115, 2015
  • Influence of La2O3 nanoparticle additions on microstructure, wetting, and tensile characteristics of Sn-Ag-Cu alloy, Materials and Design, Vol 87, p.370-379, 2015

    ÇØ¿ÜÇмúÁö - SCOPUSµîÀç
  • High Shear Speed Characteristics of Sub-100 mm Low Alpha SAC105 Solder Bump Directly Fabricated on Cu Filled Through Si Via for 3D Integration, J. of Microelectronics and Electronic Packaging, Vol 12, Issue 3, p.161-169, 2015

    ±¹³»ÇмúÁö
  • Aluminium Based Brazing Fillers for High Temperature Electronic Packaging Applications, J. Microelectron. Packag. Soc., Vol 22, Issue 4, p.1 - 5, 2015 (KCI)
  • ÀÚµ¿Â÷¿ë ÆÄ¿ö ¸ðµâ ÆÐŰ¡ÀÇ Àº ¼ÒÀ縦 ÀÌ¿ëÇÑ Á¢ÇÕ ±â¼ú, J. Microelectron. Packag. Soc., Vol 22, Issue 4, p.15-23, 2015 (KCI)
  • 3Â÷¿ø ½ÇÀåÀ» À§ÇÑ TSVÀÇ Cu ÀüÇصµ±Ý ¹× ·Î¿ì¾ËÆÄ ¼Ö´õ ¹üÇÎ, J. Microelectron. Packag. Soc., Vol 22, Issue 4, p.7-14, 2015 (KCI)
  • ÀÚµ¿Â÷ ÀüÀå¿ë ¹«¿¬ ¼Ö´õ ±â¼ú, J. Microelectron. Packag. Soc., Vol 22, Issue 3, p.1-7, 2015 (KCI)
  • Influence of Various Additional Elements in Al Based Filler Alloys for Automotive and Brazing Industry, J. of Welding and Joining, Vol. 33, Issue5, p.1-8, 2015

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  • ÀÚµ¿Â÷¿ë ¹«¿¬ ¼Ö´õ ÆäÀ̽ºÆ® Á¦Á¶ ¹× Ư¼ºÆò°¡, 2015³âµµ ´ëÇѱݼӡ¤Àç·áÇÐȸ Ãá°èÇмú´ëȸ ÀÏÁ¤Áý, 2015³â 4¿ù
  • Development of Al-Si-Cu Filler Metal for Low Temperature Al-Brazing Process, 2015³âµµ ´ëÇѱݼӡ¤Àç·áÇÐȸ Ãá°èÇмú´ëȸ ÀÏÁ¤Áý, 2015³â 4¿ù

    2015³âµµ Çѱ¹¸¶ÀÌÅ©·ÎÀüÀÚ ¹× ÆÐŰ¡ÇÐȸ(KMEPS) Ãá°è Çмú´ëȸ ÇÐȸÁö
  • µµ±Ý½Ã°£ ¹× Àü·ù¹Ðµµ¿¡ µû¸¥ TSV³» Cu ÃæÀü ¹× ·Î¿ì¾ËÆÄ ¼Ö´õ ¹üÇÎ, 2015³âµµ Çѱ¹¸¶ÀÌÅ©·ÎÀüÀÚ ¹× ÆÐŰ¡ÇÐȸ(KMEPS) Ãá°è Çмú´ëȸ ÀÏÁ¤Áý, 2015³â 4¿ù
  • ÀÚµ¿Â÷ ÀüÀåÇ°¿ë ¹«¿¬ ¼Ö´õ ÆäÀ̽ºÆ® °³¹ß ¹× Ư¼ºÆò°¡, 2015³âµµ Çѱ¹¸¶ÀÌÅ©·ÎÀüÀÚ ¹× ÆÐŰ¡ÇÐȸ(KMEPS) Ãá°è Çмú´ëȸ ÀÏÁ¤Áý, 2015³â 4¿ù

    TORONTO' 2015 AES-ATEMA 25th international conference
    Oral presentation
  • Zirconia Nanoparticle Reinforced Al-Si-Cu Alloy Based Co,posite for Low Temperature Brazing Application, Advances and Trends in Engineering Materials and their Applications, August, 2015

    2015³âµµ MPC Ãß°è½ÉÆ÷Áö¿ò
  • ÀÚµ¿Â÷ ÀüÀå¿ë ¾Ë·ç¹Ì´½ ºê·¹ÀÌ¡ Ç÷°½ºÀÇ Ã·°¡Á¦º° Á¢ÇÕƯ¼º, ÀÚµ¿Â÷ÀüÀåÇ° ÃֽŠÁ¢ÇÕ±â¼ú, 2015³â 9¿ù
  • ÀÚµ¿Â÷ ÀüÀåÇ°¿ë ¹«¿¬ ¼Ö´õ ÆäÀ̽ºÆ®ÀÇ Æ¯¼º, ÀÚµ¿Â÷ÀüÀåÇ° ÃֽŠÁ¢ÇÕ±â¼ú, 2015³â 9¿ù

    ISMP 2015 the 14th International Symposium on Microelectronics and Packaging
  • Development of Pb-free Solder Paste for Automotive Electronics, ISMP 2015 the 14th International Symposium notice, October, 2015
  • Microstructure and Sheer Strength of lead-free Solder Joint for Automotive Application, ISMP 2015 the 14th International Symposium notice, October, 2015
  • Properties of Surfactant in Aluminum Brazing Flux for Automobile, ISMP 2015 the 14th International Symposium notice, October, 2015

    2015³âµµ Çѱ¹Ç¥¸é°øÇÐȸ Ãß°èÇмú´ëȸ
    Oral presentation
  • Effect of bath conditions and pulse parameters on tin surface finish for microelectronic packaging applications, 2015³âµµ Çѱ¹Ç¥¸é°øÇÐȸ Ãß°èÇмú´ëȸ ³í¹®Áý, 2015³â 11¿ù

    2015³âµµ ´ëÇÑ¿ëÁ¢¡¤Á¢ÇÕÇÐȸ Ãß°èÇмú¹ßÇ¥´ëȸ
  • ÀÚµ¿Â÷ Â÷ü¿ë ¾Æ¿¬µµ±Ý°­ÆÇÀÇ ¿ëÁ¢Æ¯¼º ¹× Èâ ¿¬±¸, 2015³âµµ ´ëÇÑ¿ëÁ¢¡¤Á¢ÇÕÇÐȸ Ãß°èÇмú¹ßÇ¥´ëȸ ÃÊ·ÏÁý, Á¦63±Ç, 2015³â 11¿ù
  • Effect of nanoparticles on the braze ability, microstructure, and mechanical properties of Al-11Si-20Cu alloy, 2015³âµµ ´ëÇÑ¿ëÁ¢¤ýÁ¢ÇÕÇÐȸ Ãß°èÇмú¹ßÇ¥´ëȸ ÃÊ·ÏÁý, Á¦63±Ç, 2015³â 11¿ù
  • Al-Si-Cu °è¿­ ÀúÀ¶Á¡ ºê·¹ÀÌ¡ ÇÕ±ÝÀÇ Á¢ÇÕ¼º´É °³¼±À» À§ÇÑ ³ª³ë ÷°¡¿ø¼Ò ¹üÀ§ ¼±Á¤¿¡ °üÇÑ ½ÇÇèÀû ¿¬±¸, 2015³âµµ ´ëÇÑ¿ëÁ¢¤ýÁ¢ÇÕÇÐȸ Ãß°èÇмú¹ßÇ¥´ëȸ ÃÊ·ÏÁý, Á¦63±Ç, 2015³â 11¿ù

 

 

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