¿¬±¸ °úÁ¦¸í |
°³½ÃÀÏ |
Á¾·áÀÏ |
Áö¿ø ±â°ü |
¼Ò°á÷°¡Á¦·®ÀÌ ÅºÈ±Ô¼Ò-ÁúÈ±Ô¼Ò º¹ÇÕÀç·áÀÇ ±â°èÀû Ư¼º¿¡ ¹ÌÄ¡´Â ¿µÇâ |
1999.5.1 |
2000.4.31 |
¼¿ï½Ã¸³´ëÇб³ |
¹Ì¼¼Á¶Á÷ Á¦¾î¿¡ ÀÇÇÑ °íÀμº źȱԼÒÀÇ °³¹ß |
1997.10.1 |
2000.8.31 |
°úÇбâ¼úºÎ |
źȱԼÒ-źÈƼŸ´½ º¹ÇÕÀç·áÀÇ ¼Ò°á°ú ¿ªÇÐÀû Ư¼º |
1998.9.1 |
2001.8.31 |
Çѱ¹°úÇÐÀç´Ü |
°í¼º´É Àý»è°ø±¸¿ë ½Å¼ÒÀç °³¹ß |
1999.12.1 |
2001.11.31 |
Çѱ¹ÇмúÁøÈïÀç´Ü |
³ª³ë °í°æµµ¼ÒÀçÀÇ ¹Ì¼¼Á¶Á÷ Á¦¾î |
2001.9.1 |
2004.8.31 |
Çѱ¹°úÇÐÀç´Ü |
´ë¸³ ÅºÈ±Ô¼Ò ºÐ¸»·ÎºÎÅÍ ¹Ì¸³ ÅºÈ±Ô¼Ò ºÐ¸»ÀÇ Á¦Á¶ |
2001.3.20 |
2002.3.19 |
(ÁÖ) ´©¸® |
Á¦ 2»ó ÷°¡°¡ ¾×»ó¼Ò°á źȱԼÒÀÇ ¹Ì¼¼Á¶Á÷ ¹ß´Þ¿¡ ¹ÌÄ¡´Â ¿µÇâ |
2001.12.1 |
2002.11.30 |
Çѱ¹ÇмúÁøÈïÀç´Ü ¼±µµ¿¬±¸ |
¸¶ÀÌÅ©·Î¼¿·ê·¯(Microcellular) ¼¼¶ó¹Í½º Á¦Á¶°øÁ¤ °³¹ß |
2001.10.1 |
2004.7.25 |
°úÇбâ¼úºÎ Frontier »ç¾÷ |
ÀÔ°è»ó Á¶¼º Á¦¾î¿¡ ÀÇÇÑ ÃÊ°í¿Â ÅºÈ±Ô¼Ò ¼¼¶ó¹Í½º Á¦Á¶ |
2003.12.1 |
2005.11.30 |
Çѱ¹ÇмúÁøÈïÀç´Ü |
¸¶ÀÌÅ©·Î¼¿·ê·¯(Microcellular) ¼¼¶ó¹Í½ºÀÇ Á¶¼ºÁ¦¾î ±â¼ú °³¹ß |
2004.7.1 |
2007.3.31 |
»ê¾÷ÀÚ¿øºÎ Frontier »ç¾÷ |
¼Ò°á¹ý¿¡ ÀÇÇÑ SiC º¹ÇÕü ±âÁö»ó °í¹ÐÈ ¿¬±¸ |
2005.3.1 |
2007.2.28 |
°úÇбâ¼úºÎ ¿øÀڷ¿¬±¸°³¹ß»ç¾÷ |
³ª³ëÅ©±â ÅºÈ±Ô¼Ò ºÐ¸»ÀÇ ¼Ò°á¼º |
2005.5.1 |
2006.4.30 |
¼¿ï½Ã¸³´ëÇб³ |
¾Ë·ç¹Ì³ª ¼¼¶ó¹Í È÷ÅÍÀÇ °øÁ¤°³¼± |
2006.10.1 |
2007.3.31 |
¢ß½ã¼¼¶óÅØ |
Á¦¾îµÈ ±â°øÀ²À» °®´Â °í°µµ ´Ù°øÁú ÅºÈ±Ô¼Ò ¼¼¶ó¹Í½º |
2006.11.1 |
2007.10.31 |
Çѱ¹ÇмúÁøÈïÀç´Ü |
±â°øÇü¼ºÁ¦ Å©±â°¡ ´Ù°øÁú ÅºÈ±Ô¼Ò ¼¼¶ó¹Í½ºÀÇ ¹Ì¼¼±¸Á¶¿Í °µµ¿¡ ¹ÌÄ¡´Â ¿µÇâ |
2007.5.1 |
2008.4.30 |
¼¿ï½Ã¸³´ëÇб³ |
´Ù°øÁú ÅºÈ±Ô¼Ò ¼ÒÀçÀÇ °áÇÕÀç Á¶¼º °³¹ß |
2007.10.1 |
2010.9.30 |
¿¡³ÊÁö°ü¸®°ø´Ü |
Àü±âÀüµµ¼º °¡¾Ð¼Ò°á SiC¼ÒÀç °³¹ß |
2007.6.1 |
2011.5.31 |
»ê¾÷ÀÚ¿øºÎ ¼ÒÀç¿øõ |
ź¼Ò¿È¯¿ø °øÁ¤¿¡ ÀÇÇÑ ÅºÈ±Ô¼Ò ³ª³ëºÐ¸»ÀÇ ÇÕ¼º±â¼ú °³¹ß |
2007.7.1 |
2008.6.30 |
»ê¾÷ÀÚ¿øºÎ ±â¼úÇõ½Å |
¸¶ÀÌÅ©·Î¼¿·ê·¯ ¼¼¶ó¹Í½ºÀÇ ¹Ì¼¼Á¶Á÷ Á¦¾î |
2007.7.1 |
2011.6.30 |
»ê¾÷ÀÚ¿øºÎ Frontier |
ÅºÈ±Ô¼Ò ³ª³ëºÐ¸» Á¦Á¶°øÁ¤°³¼± |
2008.5.1 |
2009.4.30 |
¢ß½ã¼¼¶óÅØ |
³ª³ë/°Å´ë±â°ø ÅºÈ±Ô¼Ò ¼¼¶ó¹Í½ºÀÇ ±â°ø±¸Á¶ Á¦¾î |
2008.9.1 |
2011.8.31 |
±³À°°úÇбâ¼úºÎ Çѱ¹°úÇÐÀç´Ü |
Çâ»óµÈ ¼º´ÉÀ» °®´Â °Å´ë±â°ø ´Ù°øÁú ÅºÈ±Ô¼Ò ¼¼¶ó¹Í½ºÀÇ »õ·Î¿î Á¦Á¶°øÁ¤ °³¹ß |
2009. 8. 12 |
2010. 08. 11 |
Çѱ¹ÇмúÁøÈïÀç´Ü |
¸¶ÀÌÅ©·Î ±â°ø ´Ù°øÁú ´Ü¿ÀçÀÇ °øÁ¤ ±â¼ú °³¹ß |
2009. 3. 01 |
2009. 12. 31 |
RIST |
ºÒ¼Ò¼º ´Ù°øÁú ´Ü¿ÀçÀÇ °øÁ¤±â¼ú °³¹ß |
2010. 3. 01 |
2010. 12. 31 |
RIST |
Â÷¼¼´ë ¹ÝµµÃ¼/LED ÇٽɰøÁ¤¿ë ÃÊ°í¼øµµ SiC Á¦Á¶±â¼ú(WPM2¼¼ºÎ°úÁ¦) |
2010. 9. 1 |
2015. 3. 31 |
Áö½Ä°æÁ¦ºÎ WPM |
°í°µµ ºÒ¼Ò¼º ´Ü¿ÀçÀÇ Á¦Á¶ ±â¼ú °³¹ß |
2011. 3. 1 |
2011. 12. 31 |
RIST |
÷°¡Á¦°¡ ½Ç¸®ÄÜ¿Á½ÃÄ«¹ÙÀÌµå °áÇÕ ÅºÈ±Ô¼Ò ¼¼¶ó¹Í½ºÀÇ ±â°èÀû °µµ¿¡ ¹ÌÄ¡´Â ¿µÇâ |
2011. 5. 1 |
2012. 4. 30 |
¼¿ï½Ã¸³´ëÇб³ |
¼¼¶ó¹Í¼ÒÀçÁ¤º¸ÀºÇà ±¸Á¶Àç·áDB ±¸Ãà |
2011. 7. 18 |
2012. 3. 17 |
Çѱ¹¼¼¶ó¹Í±â¼ú¿ø |
¼¼¶ó¹Í ºÐ¸®¸· ¼ÒÀçÀÇ ½ÅÁ¶¼º Ž±¸ ¹× °æÁ¦ÀûÀÎ Á¦Á¶°øÁ¤¿¡ °üÇÑ ¿¬±¸ |
2012. 1. 1 |
2014. 12. 31 |
Çѱ¹±â°è¿¬±¸¿ø ºÎ¼³Àç·á¿¬±¸¼Ò Àç·á¿¬±¸¼Ò ÁÖ¿ä»ç¾÷ |
°í±â´É¼º źȱԼÒ-Áúȹ° º¹ÇÕÀç·á |
2012. 5. 1 |
2015. 4. 30 |
Çѱ¹¿¬±¸Àç´Ü Áß°ß¿¬±¸ÀÚÁö¿ø»ç¾÷ |
°í¼øµµ ´Ù°øÁú SiC ¼ÒÀç ±â°ø·ü Á¦¾î ±â¼ú |
2012. 8. 15 |
2013. 7. 15 |
RIST |
½ã¼¼¶óÅØ ÁúÈ±Ô¼Ò ºÐ¸»ÀÇ »êó¸® ¹× ¼Ò°á¼º ½ÃÇè |
2012. 10. 1 |
2013. 9. 30 |
¢ß½ã¼¼¶óÅØ |
¼¼¶ó¹Í¼ÒÀçÁ¤º¸ÀºÇà ±¸Á¶Àç·áDB ±¸Ãà |
2014. 1. 1 |
2014. 5. 31 |
Çѱ¹¼¼¶ó¹Í±â¼ú¿ø |
¼¼¶ó¹Í¼ÒÀçÁ¤º¸ÀºÇà ±¸Á¶Àç·áDB ±¸Ãà |
2014. 12. 3 |
2015. 6. 30 |
Çѱ¹¼¼¶ó¹Í±â¼ú¿ø |
Development of Accident Tolerant SiC based Pellet for Innovative Nuclear Fuel |
2013.10.01 |
2016.09.30 |
Korea Institute of Energy Technology Evaluation and Planning |
Development of Functional Silicon Oxycarbide Ceramics |
2013.11.01 |
2016.10.31 |
National Research Foundation |
Developement of low temperature sintering and new composition for SiC membrane |
2015.01.01 |
2017.12.31 |
Korea Institute of Material Science |
Effect of Grain Boundary Structure on Electrical and Thermal Properties of Silicon Carbide Ceramics |
2015.05.01 |
2018.04.30 |
National Research Foundation |
Development of Pressureless Sintered Semiconductor-Grade Silicon Carbide Ceramics with High Density and High Thermal Conductivity |
2015.06.01 |
2016.05.31 |
Small and Medium business Administration |
Development of SiC Ceramics with a Dimension of 300 mm in Diameter and 9 X 10^3 ohm cm of Electrical Resistivity for Semiconductor Processing Components |
2016.11.01 |
2017.10.30 |
Korea Institute for Advancement of Technology |
ź¼Ò-¼¼¶ó¹Í º¹ÇÕÀç ºê·¹ÀÌÅ© ´ë·® »ý»ê¿ë ÄÚ¾î »ðÀÔ ¼ºÇü°øÁ¤ ¹× ±Þ¼Ó ±Ô¼ÒÇÔħ °øÁ¤°³¹ß |
2016.11.01 |
2017.10.31 |
ÀüºÏTP |
ģȯ°æ ¿î¼Û¼ö´Ü ¿£Áø¿ë °í°µµ ³»¸¶¸ð¼º ÅºÈ±Ô¼Ò ³ª³ë º¹ÇÕÀç·á |
2017.03.01 |
2020.02.28 |
¹Ì·¡Ã¢Á¶ºÎ |
Á¶»ç½ÃÇè¿ë »ç°íÀúÇ×¼º Çâ»ó ÇÙ¿¬·á ½ÃÀÛÇ°°³¹ß |
2017.12.01 |
2022.11.30 |
»ê¾÷Åë»óÀÚ¿øºÎ |
Highly Thermally Insulating/Thermally Conducting SiC Ceramics with Nanopore Structure |
2018.06.01 |
2023.05.31 |
National Research Foundation of Korea |
Composition Development for Pyrogenic Ceramic Supports |
2019.01.01 |
2021.12.31 |
Korea Institute of Materials Science |
Development of Localization Technology for Pressureless Sintered, Electrical Resistivity Controlled (0.1~30§Ùcm) 10nm Semiconductor-grade New-SiC without Free-Si, and CVD-SiC coated New-SiC |
2020.04.01 |
2023.12.31 |
Ministry of Trade, industry and Energy |